PTI is a group of researchers, engineers, and professionals who are dedicated to enhancing the overall package quality experience over the course of the packaging lifecycle. To ensure container closure integrity, PTI has created and developed a number of inspection technology platforms. Each technology is based on the principle that there cannot be a test method without a valid test method. The technology solutions provided by PTI are centred on container closure integrity and give a deterministic measurement of package performance needed by critical applications. By delivering package performance data from the development stage to in-production online package inspection, the solutions are widely utilized to address a variety of packaging design and material difficulties.
List of CCI and Package Integrity Techniques Offered by PTI:
1. Vacuum Decay Technology
Vacuum Decay is one of the most practical and sensitive vacuum-based leak detection techniques. This test provides the most accurate, repeatable, and reliable quantitative results, along with a pass/fail determination. The ASTM F2338 standard vacuum decay test method was developed using PTI’s VeriPac instruments. Additionally, it is recognized in the United States Pharmacopeia Chapter on CCI and classified in ISO 11607. The non-destructive container closure integrity testing (CCIT) method from VeriPac can use a differential pressure or absolute pressure transducer leak test device to find package leaks and undetectable defects.
2. Microcurrent HVLD Technology
PTI packaging and inspection systems transformed the traditional HVLD method and offered a new technology for assessing the integrity of all parenteral and biological products, including low conductivity liquids such as sterile water for injection (WFI). When compared to standard HVLD solutions, this innovative technology, known as Microcurrent HVLD, uses approximately 50% less voltage and exposes the product and environment to less than 5% of that voltage. The Microcurrent HVLD test method may detect and locate pinholes, micro-cracks, stopper/plunger leaks, non-visible leaks under crimping, and a variety of other defects.
3. Helium Leak Detection Technology
Helium leak testing is the process of identifying leaks in various enclosed or sealed systems by utilizing helium as a "tracer" gas and measuring the concentration of the gas as it escapes as a result of a leak. Because it is non-toxic, non-flammable, non-condensable, and its atmospheric concentration is less than 5 ppm, helium is utilized as a tracer gas. Helium can pass through almost any cracks or openings since it is the second-smallest molecule in the periodic table. Additionally, helium is relatively safe to use because it does not react with other substances. This method uses a mass spectrometer leak detector (MSLD), also known as a helium leak detector, to locate and measure the leak.
4. Airborne Ultrasound Technology
PTI's proprietary Airborne Ultrasound technique is a non-destructive, non-invasive seal quality inspection method. Airborne Ultrasound technology offers thorough seal quality studies and is applicable to a wide range of packaging materials, including: Tyvek, paper, foil, film, aluminium, plastic, and poly. Defects of many forms, visible and invisible, leaking and non-leaking, process-related and random, can be detected. Airborne Ultrasound technology is an ASTM Test Method F3004 and an FDA-approved standard for testing seal quality.
5. Volumetric Imaging Technology
The OptiPac One-Touch Tool-less technology is intended for non-destructive leak detection of blister packages. To identify leaks, the OptiPac uses volumetric imaging technology to measure the motion of a blister package under vacuum. With new blister package formats, the interface is practical and straightforward to set up, requiring no tooling changeover or extensive parameter modifications as seen with previous non-destructive blister package inspection systems. The system collects volumetric data from each cavity, responding to variable cavity shapes, sizes, and configurations of various blister pack forms.
6. Force Decay Technology
Force Decay is a quantitative package integrity testing approach that is well-suited for low-headspace packaging. Non-porous materials, such as films, laminates, or foils, can be used in packaging formats. It does not harm or modify the sample packages because it is a non-destructive test method. When the test is finished, the packages can be returned to the batch without being discarded. The 410's force decay technology can measure force from a package's surface deflection during a conventional vacuum-based test cycle. VeriPac 410 force decay technology has been validated on a variety of package types, including: blister packs, transdermal patch sachets, and low headspace suture packs.
PTI’s continuous technology development has brought more technology and measurement solutions to market under one brand. Whether it be helium leak detection, high voltage leak detection, airborne ultrasound, or a vacuum-based solution, PTI - Science of Quality is the think tank you can rely on to provide the highest level of technology solutions for package quality. PTI continues to build on our journey, and we look forward to supporting you on yours.